Sulfonyl‐Containing Polyimide Dielectrics with Advanced Heat Resistance and Dielectric Properties for High‐Temperature Capacitor Applications-Reference-Cited by-同舟云学术

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Sulfonyl‐Containing Polyimide Dielectrics with Advanced Heat Resistance and Dielectric Properties for High‐Temperature Capacitor Applications

Published:2019-01-25 Issue:4 Volume:304 Page:1800709
ISSN:1438-7492
Container-title:Macromolecular Materials and Engineering
language:en
Short-container-title:Macromol. Mater. Eng.

Author:

Tong Hui¹,Fu Jing²,Ahmad Aftab¹³,Fan Tao¹,Hou Yudong²,Xu Ju¹³

Affiliation:

1. Institute of Electric and EngineeringChinese Academy of Sciences Beijing 100190 China

2. College of Materials Science and EngineeringBeijing University of Technology Beijing 100124 China

3. College of Engineering ScienceUniversity of Chinese Academy of Sciences Beijing 100049 China

Funder

National Key Research and Development Program of China

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Organic Chemistry,General Chemical Engineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/mame.201800709

Reference38 articles.

1. High-Temperature Dielectric Materials for Electrical Energy Storage

2. Flexible high-temperature dielectric materials from polymer nanocomposites

3. Novel Ferroelectric Polymers for High Energy Density and Low Loss Dielectrics

4. High-Temperature Capacitor Polymer Films

5. 50th Anniversary Perspective: Dielectric Phenomena in Polymers and Multilayered Dielectric Films

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4. Enhanced high-temperature capacitive performance through introduction of polar groups in poly(aryl ether ketone) dielectric polymer;Journal of Energy Storage;2024-08

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