The Role of the Microstructure of Copper Deposits During Electroless Plating in Formaldehyde Containing Alkaline Baths. Comparison of Fourier Transform Impedance Spectroscopy and Surface Enhanced Raman Spectroscopy-Reference-Cited by-同舟云学术

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The Role of the Microstructure of Copper Deposits During Electroless Plating in Formaldehyde Containing Alkaline Baths. Comparison of Fourier Transform Impedance Spectroscopy and Surface Enhanced Raman Spectroscopy

Published:1992-05 Issue:5 Volume:96 Page:647-656
ISSN:0005-9021
Container-title:Berichte der Bunsengesellschaft für physikalische Chemie
language:en
Short-container-title:Berichte der Bunsengesellschaft für physikalische Chemie

Author:

Bittner Alexander,Wanner Michael,Weil Konrad G.

Publisher

Wiley

Subject

General Chemical Engineering

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/bbpc.19920960503/fullpdf

Reference18 articles.

1. Plating (East Orange;Lukes;N. J.),1964

2. Plating (East Orange;Paunovic;N. J.),1968

3. On the Mechanism of Electroless Copper Deposition

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Properties of an electroless copper process as a function of nickel and cyanide ion concentrations;Journal of Applied Electrochemistry;2021-02-14

2. Mechanism of Electroless Plating;Amorphous and Nano Alloys Electroless Depositions;2016

3. Galvanic and bipolar cells as probes of electroless deposition: The Cu–dimethylamine borane system;Electrochemistry Communications;2013-12

4. Autocatalysis during Electroless Copper Deposition using Glyoxylic Acid as Reducing Agent;Journal of The Electrochemical Society;2013

5. Application of the Quartz Microbalance in Electrochemistry;Methods in Physical Chemistry;2012-04-25

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