Effect of an Alkoxyliertes Beta Naphthol on Cu Electrodeposition for Application to Low‐Resistivity Cu Interconnects-Reference-Cited by-同舟云学术

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Effect of an Alkoxyliertes Beta Naphthol on Cu Electrodeposition for Application to Low‐Resistivity Cu Interconnects

Published:2020-03-16 Issue:5 Volume:41 Page:530-536
ISSN:1229-5949
Container-title:Bulletin of the Korean Chemical Society
language:en
Short-container-title:Bull. Korean Chem. Soc.

Author:

Suh Hoyoung¹²,Heo Mina³⁴,Lee Ji‐Hyun¹,Kim Jin‐Gyu¹,Hong Kimin³

Affiliation:

1. Electron Microscopy Research CenterKorea Basic Science Institute Daejeon 34133 Korea

2. Advanced Analysis CenterKorea Institute of Science and Technology Seoul 02792 Korea

3. Department of PhysicsChungnam National University Daejeon 34134 Korea

4. PLP Technology GroupSamsung Electro‐Mechanics Cheonan 31086 Korea

Funder

Chungnam National University

Publisher

Wiley

Subject

General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/bkcs.12003

Reference30 articles.

1. Damascene copper electroplating for chip interconnections

2. High-performance interconnects: an integration overview

3. Superconformal Electrodeposition of Copper in 500–90 nm Features

4. A Superfilling Model that Predicts Bump Formation

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