Multifactor roadmap for designing low‐power‐consumed micro thermoelectric thermostats in a closed‐loop integrated 5G optical module

Abstract

AbstractAs the core components of fifth‐generation (5G) communication technology, optical modules should be consistently miniaturized in size while improving their level of integration. This inevitably leads to a dramatic spike in power consumption and a consequent increase in heat flow density when operating in a confined space. To ensure a successful start‐up and operation of 5G optical modules, active cooling and precise temperature control via the Peltier effect in confined space is essential yet challenging. In this work, p‐type Bi0.5Sb1.5Te3 and n‐type Bi2Te2.7Se0.3 bulk thermoelectric (TE) materials are used, and a micro thermoelectric thermostat (micro‐TET) (device size, 2 × 9.3 × 1.1 mm3; leg size, 0.4 × 0.4 × 0.5 mm3; number of legs, 44) is successfully integrated into a 5G optical module with Quad Small Form Pluggable 28 interface. As a result, the internal temperature of this kind of optical module is always maintained at 45.7°C and the optical power is up to 7.4 dBm. Furthermore, a multifactor design roadmap is created based on a 3D numerical model using the ANSYS finite element method, taking into account the number of legs (N), leg width (W), leg length (L), filling atmosphere, electric contact resistance (Rec), thermal contact resistance (Rtc), ambient temperature (Ta), and the heat generated by the laser source (QL). It facilitates the integrated fabrication of micro‐TET, and shows the way to enhance packaging and performance under different operating conditions. According to the roadmap, the micro‐TET (2 × 9.3 × 1 mm3, W = 0.3 mm, L = 0.4 mm, N = 68 legs) is fabricated and consumes only 0.89 W in cooling mode (QL = 0.7 W, Ta = 80°C) and 0.36 W in heating mode (Ta = 0°C) to maintain the laser temperature of 50°C. This research will hopefully be applied to other microprocessors for precise temperature control and integrated manufacturing.