Soft Microreactors for the Deposition of Conductive Metallic Traces on Planar, Embossed, and Curved Surfaces-Reference-Cited by-同舟云学术

Soft Microreactors for the Deposition of Conductive Metallic Traces on Planar, Embossed, and Curved Surfaces

Published:2018-08-10 Issue:40 Volume:28 Page:1803020
ISSN:1616-301X
Container-title:Advanced Functional Materials
language:en
Short-container-title:Adv. Funct. Mater.

Author:

Konda Abhiteja¹^ORCID,Rau Advaith¹,Stoller Michael A.¹,Taylor Jay M.¹,Salam Abdul²,Pribil Gabriel A.¹,Argyropoulos Christos³⁴^ORCID,Morin Stephen A.¹⁴^ORCID

Affiliation:

1. Department of Chemistry University of Nebraska–Lincoln Lincoln NE 68588 USA

2. Department of Computer and Information Technology Purdue University West Lafayette IN 47907 USA

3. Department of Electrical and Computer Engineering University of Nebraska–Lincoln Lincoln NE 68588 USA

4. Nebraska Center for Materials and Nanoscience University of Nebraska–Lincoln Lincoln NE 68588 USA

Funder

University of Nebraska-Lincoln

National Science Foundation

Publisher

Wiley

Subject

Electrochemistry,Condensed Matter Physics,Biomaterials,Electronic, Optical and Magnetic Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adfm.201803020

Reference72 articles.

1. Investigation and improvement of reversible microfluidic devices based on glass–PDMS–glass sandwich configuration

2. Reconfigurable microfluidic systems with reversible seals compatible with 2D and 3D surfaces of arbitrary chemical composition

3. Chapter 4—Advantages and Disadvantages of Electroplated Coatings

4. Electrochemical processing technologies in chip fabrication: challenges and opportunities

5. Electroless plating of plastics

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