Mechanically Guided Post‐Assembly of 3D Electronic Systems

Author:

Kim Bong Hoon1ORCID,Liu Fei2,Yu Yongjoon3,Jang Hokyung3,Xie Zhaoqian45,Li Kan45,Lee Jungyup3,Jeong Ji Yoon3,Ryu Arin3,Lee Yechan3,Kim Do Hoon3,Wang Xueju1,Lee KunHyuck1,Lee Jong Yoon3,Won Sang Min3,Oh Nuri6,Kim Jeonghyun7,Kim Ju Young8,Jeong Seong‐Jun9,Jang Kyung‐In10,Lee Seungmin11,Huang Yonggang12,Zhang Yihui2,Rogers John A.13

Affiliation:

1. Department of Materials Science and Engineering Simpson Querrey Institute and Feinberg Medical School Center for Bio‐Integrated Electronics Northwestern University Evanston IL 60208 USA

2. Center for Mechanics and Materials Center for Flexible Electronics Technology AML, Department of Engineering Mechanics Tsinghua University Beijing 100084 China

3. Frederick Seitz Materials Research Laboratory University of Illinois at Urbana‐Champaign Urbana IL 61801 USA

4. Department of Civil and Environmental Engineering Mechanical Engineering, and Materials Science and Engineering Northwestern University Evanston IL 60208 USA

5. AML, Department of Engineering Mechanics Center for Mechanics and Materials Tsinghua University Beijing 100084 China

6. Division of Materials Science and Engineering Hanyang University Seoul 04763 Republic of Korea

7. Department of Electronics Convergence Engineering Kwangwoon University Seoul 01897 Republic of Korea

8. Multidisciplinary Sensor Research Group Electronics and Telecommunications Research Institute (ETRI) Daejeon 34129 Republic of Korea

9. Department of Organic Materials and Fiber Engineering Department of Information Communication Materials, and Chemistry Convergence Technology Soongsil University 369 Sangdo‐ro Dongjak‐gu Seoul 06978 Republic of Korea

10. Department of Robotics Engineering Daegu Gyeongbuk Institute of Science and Technology (DGIST) Daegu 42988 Republic of Korea

11. Department of Energy Electronics Convergence Kookmin University Seoul 02707 Republic of Korea

12. Department of Civil and Environmental Engineering Mechanical Engineering Materials Science and Engineering Northwestern University Evanston IL 60208 USA

13. Department of Materials Science and Engineering Department of Biomedical Engineering Department of Chemistry Department of Neurological Surgery Department of Mechanical Engineering Department of Electrical Engineering and Computer Science Simpson Querrey Institute and Feinberg Medical School Center for Bio‐Integrated Electronics Northwestern University Evanston IL 60208 USA

Funder

National Science Foundation

National Natural Science Foundation of China

Tsinghua National Laboratory for Information Science and Technology

Publisher

Wiley

Subject

Electrochemistry,Condensed Matter Physics,Biomaterials,Electronic, Optical and Magnetic Materials

Cited by 55 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3