Mechanically Guided Post‐Assembly of 3D Electronic Systems

Author:

Kim Bong Hoon1ORCID,Liu Fei2,Yu Yongjoon3,Jang Hokyung3,Xie Zhaoqian45,Li Kan45,Lee Jungyup3,Jeong Ji Yoon3,Ryu Arin3,Lee Yechan3,Kim Do Hoon3,Wang Xueju1,Lee KunHyuck1,Lee Jong Yoon3,Won Sang Min3,Oh Nuri6,Kim Jeonghyun7,Kim Ju Young8,Jeong Seong‐Jun9,Jang Kyung‐In10,Lee Seungmin11,Huang Yonggang12,Zhang Yihui2,Rogers John A.13

Affiliation:

1. Department of Materials Science and Engineering Simpson Querrey Institute and Feinberg Medical School Center for Bio‐Integrated Electronics Northwestern University Evanston IL 60208 USA

2. Center for Mechanics and Materials Center for Flexible Electronics Technology AML, Department of Engineering Mechanics Tsinghua University Beijing 100084 China

3. Frederick Seitz Materials Research Laboratory University of Illinois at Urbana‐Champaign Urbana IL 61801 USA

4. Department of Civil and Environmental Engineering Mechanical Engineering, and Materials Science and Engineering Northwestern University Evanston IL 60208 USA

5. AML, Department of Engineering Mechanics Center for Mechanics and Materials Tsinghua University Beijing 100084 China

6. Division of Materials Science and Engineering Hanyang University Seoul 04763 Republic of Korea

7. Department of Electronics Convergence Engineering Kwangwoon University Seoul 01897 Republic of Korea

8. Multidisciplinary Sensor Research Group Electronics and Telecommunications Research Institute (ETRI) Daejeon 34129 Republic of Korea

9. Department of Organic Materials and Fiber Engineering Department of Information Communication Materials, and Chemistry Convergence Technology Soongsil University 369 Sangdo‐ro Dongjak‐gu Seoul 06978 Republic of Korea

10. Department of Robotics Engineering Daegu Gyeongbuk Institute of Science and Technology (DGIST) Daegu 42988 Republic of Korea

11. Department of Energy Electronics Convergence Kookmin University Seoul 02707 Republic of Korea

12. Department of Civil and Environmental Engineering Mechanical Engineering Materials Science and Engineering Northwestern University Evanston IL 60208 USA

13. Department of Materials Science and Engineering Department of Biomedical Engineering Department of Chemistry Department of Neurological Surgery Department of Mechanical Engineering Department of Electrical Engineering and Computer Science Simpson Querrey Institute and Feinberg Medical School Center for Bio‐Integrated Electronics Northwestern University Evanston IL 60208 USA

Funder

National Science Foundation

National Natural Science Foundation of China

Tsinghua National Laboratory for Information Science and Technology

Publisher

Wiley

Subject

Electrochemistry,Condensed Matter Physics,Biomaterials,Electronic, Optical and Magnetic Materials

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