Conformal Hermetic Sealing of Wireless Microelectronic Implantable Chiplets by Multilayered Atomic Layer Deposition (ALD)-Reference-Cited by-同舟云学术

Conformal Hermetic Sealing of Wireless Microelectronic Implantable Chiplets by Multilayered Atomic Layer Deposition (ALD)

Author:

Jeong Joonsoo¹²,Laiwalla Farah¹,Lee Jihun¹,Ritasalo Riina³,Pudas Marko³,Larson Lawrence¹,Leung Vincent⁴,Nurmikko Arto¹^ORCID

Affiliation:

1. School of Engineering Brown University Providence RI 02912 USA

2. Department of Biomedical Engineering School of Medicine Pusan National University Yangsan 50612 Republic of Korea

3. Picosun Oy Espoo 02150 Finland

4. Department of Electrical Engineering University of California San Diego CA 92161 USA

Funder

Defense Advanced Research Projects Agency

National Institutes of Health

Publisher

Wiley

Subject

Electrochemistry,Condensed Matter Physics,Biomaterials,Electronic, Optical and Magnetic Materials

Link

Reference54 articles.

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