Direct bonding and de‐bonding on demand of polystyrene and polyamide surfaces, treated with oxygen plasma-Reference-Cited by-同舟云学术

Direct bonding and de‐bonding on demand of polystyrene and polyamide surfaces, treated with oxygen plasma

Published:2021-10-07 Issue:10 Volume:139 Page:51753
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J Appl Polym Sci

Author:

Günther Roman¹²^ORCID,Caseri Walter R.²^ORCID,Brändli Christof¹^ORCID

Affiliation:

1. Laboratory of Adhesives and Polymer Materials Institute of Materials and Process Engineering, Zurich University of Applied Sciences Winterthur Switzerland

2. Laboratory for Multifunctional Materials, Department of Materials ETH Zurich Zurich Switzerland

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/app.51753

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1. Low-temperature, simple and fast integration technique of microfluidic chips by using a UV-curable adhesive

2. NOA 63 as a UV-curable material for fabrication of microfluidic channels with native hydrophilicity

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4. Autohesion of polymers

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