Compensation of Pinhole Defects in Food Packages by Application of Iron-based Oxygen Scavenging Multilayer Films-Reference-Cited by-同舟云学术

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Compensation of Pinhole Defects in Food Packages by Application of Iron-based Oxygen Scavenging Multilayer Films

Published:2012-03-13 Issue:1 Volume:26 Page:17-30
ISSN:0894-3214
Container-title:Packaging Technology and Science
language:en
Short-container-title:Packag. Technol. Sci.

Author:

Sängerlaub Sven¹²,Gibis Doris¹²,Kirchhoff Eva¹,Tittjung Melanie³,Schmid Markus¹,Müller Kajetan¹

Affiliation:

1. Fraunhofer Institute for Process Engineering and Packaging IVV; Giggenhauser Straße 35 Freising D-85354 Germany

2. Technische Universität München; Chair for Food Packaging Technology; Weihenstephaner Steig 22 Freising D-85350 Germany

3. Hochschule der Medien; Nobelstraße 10 Stuttgart D-70569 Germany

Publisher

Wiley

Subject

Mechanical Engineering,General Materials Science,General Chemistry

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/pts.1962/fullpdf

Reference41 articles.

1. Oxygen diffusion barrier properties of transparent oxide coatings on polymeric substrates;Chatham;Surface and Coatings Technology,1996

2. Development of high barrier films on flexible polymer substrates;Charton;Thin Solid Films,2006

3. Effect of Modified Atmosphere Packaging and Storage Time on Physical and Sensory Properties of Sliced Salami;Esturk;Journal of Food Processing and Preservation,2009

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