Combined analysis methods for investigating titanium and nickel surface contamination after plasma deep etching-Reference-Cited by-同舟云学术

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Combined analysis methods for investigating titanium and nickel surface contamination after plasma deep etching

Published:2021-11-11 Issue:2 Volume:54 Page:134-147
ISSN:0142-2421
Container-title:Surface and Interface Analysis
language:en
Short-container-title:Surface & Interface Analysis

Author:

Ettouri Rim¹²^ORCID,Tillocher Thomas¹^ORCID,Lefaucheux Philippe¹,Boutaud Bertrand²,Fernandez Vincent³,Fairley Neal⁴,Cardinaud Christophe³^ORCID,Girard Aurélie³,Dussart Rémi¹^ORCID

Affiliation:

1. Groupe de recherches sur l'énergétique des milieux ionisés (GREMI) CNRS‐University of Orléans Orléans Cedex 2 France

2. MISTIC SAS Issy‐les‐Moulineaux 92130 France

3. Institut des matériaux Jean‐Rouxel (IMN) CNRS‐University of Nantes Nantes France

4. Casa Software Ltd Bay House, 5 Grosvenor Terrace Teignmouth Devon TQ14 8NE UK

Publisher

Wiley

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/sia.7030

Reference32 articles.

1. Dry etching of Ti in chlorine containing feeds

2. Plasma etching of Ti in fluorine‐containing feeds

3. High-aspect-ratio bulk micromachining of titanium

4. Inductively Coupled Plasma Etching of Bulk Titanium for MEMS Applications

5. ParkerER ThibeaultBJ AimiMF RaoMP MacDonaldNC.Monocyclic high aspect ratio titanium inductively coupled plasma deep etching processes and products so produced. US8685266B2 https://patents.google.com/patent/US8685266/en;2014.

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