Copper Seed Layer Deposition by a New Liquid Precursor
Author:
Publisher
Wiley
Subject
Process Chemistry and Technology,Surfaces and Interfaces,General Chemistry
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/cvde.201006899/fullpdf
Reference18 articles.
1. Copper Metallization for High Performance Silicon Technology
2. Characteristics of chemical-vapor-deposited copper on the Cu-seeded TiN substrates
3. Characteristics of copper films produced via atomic layer deposition
4. The Effect of Adding Hexafluoroacetylacetone on Chemical Vapor Deposition of Copper Using Cu(I) and Cu(II) Precursor Systems
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