Low Temperature Lead‐Free Alloys and Solder Pastes-Reference-Cited by-同舟云学术

Low Temperature Lead‐Free Alloys and Solder Pastes

Published:2020-07-03 Issue: Volume: Page:95-154
ISSN:
Container-title:Lead‐free Soldering Process Development and Reliability
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Author:

Aspandiar Raiyo,Badwe Nilesh,Byrd Kevin

Publisher

Wiley

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/9781119482093.ch5

Reference70 articles.

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3. Bath J.(2013)Global trends in electronics and the impact on tin use. Presentation at the 2013 ITRI World Tin Conference Kunming China.

4. Holtzer M.andMok T.W.(2013)Eliminating wave soldering with low melting point solder paste.Proceedings of the SMTAI Conference(October 2013).

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