Anisotropic Charge Transport Enabling High‐Throughput and High‐Aspect‐Ratio Wet Etching of Silicon Carbide

Author:

Shi Dachuang1,Chen Yun1ORCID,Li Zijian1,Dong Shankun1,Li Liyi2,Hou Maoxiang1,Liu Huilong1,Zhao Shenghe3,Chen Xin1,Wong Ching‐Ping4,Zhao Ni3ORCID

Affiliation:

1. State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment School of Electromechanical Engineering Guangdong University of Technology Guangzhou 510006 China

2. School of Electronic Science and Engineering Southeast University Nanjing Jiangsu 211189 China

3. Faculty of Engineering The Chinese University of Hong Kong Shatin Hong Kong 999077 China

4. School of Materials Science and Engineering Georgia Institute of Technology Atlanta GA 30332 USA

Funder

National Natural Science Foundation of China

Natural Science Foundation of Guangdong Province

Publisher

Wiley

Subject

General Materials Science,General Chemistry

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3