Effects of Sodium Hydroxyethyl Sulfonate on Improving the Ductility of the Copper Films Deposited by Electroless Plating from High‐Speed Plating Baths-Reference-Cited by-同舟云学术

Effects of Sodium Hydroxyethyl Sulfonate on Improving the Ductility of the Copper Films Deposited by Electroless Plating from High‐Speed Plating Baths

Published:2018-05-14 Issue:18 Volume:3 Page:5082-5086
ISSN:2365-6549
Container-title:ChemistrySelect
language:en
Short-container-title:ChemistrySelect

Author:

Wu Minxian¹,Xu Chao¹,Wang Wenchang¹,Mitsuzaki Naotoshi²,Chen Zhidong¹

Affiliation:

1. Jiangsu Key Laboratory of Advanced Catalytic Materials and TechnologySchool of Petrochemical EngineeringChangzhou UniversityJiangsu Key Laboratory of Materials Surface Science and TechnologySchool of Material Science and EngineeringChangzhou University Changzhou 213164 China

2. Qualtec Co., Ltd Osaka 590–0906 Japan

Funder

National Natural Science Foundation of China

Publisher

Wiley

Subject

General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/slct.201702385

Reference27 articles.

2. Supplier management for manufacturer ? a case study of flexible PCB

3. Ductile electroless Ni–P coating onto flexible printed circuit board

4. Electroless copper deposition for ULSI

5. Acceleration of Electroless Copper Deposition in the Presence of Excess Triethanolamine

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