Effects of Silver Ions on High‐Speed Electroless Copper-Reference-Cited by-同舟云学术

Effects of Silver Ions on High‐Speed Electroless Copper

Published:2019-09-11 Issue:34 Volume:4 Page:10079-10083
ISSN:2365-6549
Container-title:ChemistrySelect
language:en
Short-container-title:ChemistrySelect

Author:

Wu Minxian¹^ORCID,Xu Chao¹,Wang Wenchang¹,Wang Shiying²,Mitsuzaki Naotoshi³,Chen Zhidong¹

Affiliation:

1. Jiangsu Key Laboratory of Advanced Catalytic Materials and Technology, School of Petrochemical EngineeringChangzhou University Changzhou 213164 China

2. Jiangsu Key Laboratory of Materials Surface Science and Technology, School of Materials Science & EngineeringChangzhou University Changzhou 213164 China

3. Qualtec Co., Ltd Osaka 590-0906 Japan

Funder

National Natural Science Foundation

Natural Science Foundation of Jiangsu Higher Education Institutions

Foundation of Jiangsu Key Laboratory of Advanced Catalytic Materials and Technology

Publisher

Wiley

Subject

General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/slct.201901400

Reference35 articles.

1. 30 years of electroless plating for semiconductor and polymer micro-systems

2. Effect of Ethanolamines on the Electroless Deposition of Copper on Functionalized Organic Surfaces

4. Acceleration of Electroless Copper Deposition in the Presence of Excess Triethanolamine

5. The Deposition Characteristics of Accelerated Nonformaldehyde Electroless Copper Plating

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