Probing the temperature sensitivity of induction time in latent cure epoxy resins-Reference-Cited by-同舟云学术

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Probing the temperature sensitivity of induction time in latent cure epoxy resins

Published:2012-12-21 Issue:10 Volume:62 Page:1451-1456
ISSN:0959-8103
Container-title:Polymer International
language:en
Short-container-title:Polym. Int.

Author:

Yousefi Amy M¹,Love Brian J²³⁴

Affiliation:

1. Bioengineering, Chemical and Paper Engineering Department; Miami University; Oxford OH 45056 USA

2. Department of Materials Science and Engineering; University of Michigan; Ann Arbor MI 48104 USA

3. Department of Biomedical Engineering; University of Michigan; Ann Arbor MI 48104 USA

4. Department of Biologic and Materials Sciences (Dentistry); University of Michigan; Ann Arbor MI 48104 USA

Publisher

Wiley

Subject

Polymers and Plastics,Materials Chemistry,Organic Chemistry

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/pi.4439/fullpdf

Reference38 articles.

1. Curing kinetics and chemorheology of epoxy/anhydride system

2. Thermoset characterization for moldability analysis

3. Kinetics and thermal characterization of thermoset cure

4. Kinetics and energetics of a fast polyurethane cure

5. Rheological changes during a urethane network polymerization

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Influence of Extrusion Temperature on Properties of Graphene Oxide-Carbon Fiber/Epoxy Composite Prepared by Vacuum Infiltration Hot-Press-Forming Experimental System;Nanomaterials;2022-10-30

2. Rheological behavior and process prediction of low viscosity epoxy resin for RTM;Journal of Wuhan University of Technology-Mater. Sci. Ed.;2014-10

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