Affiliation:
1. School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST) Daejeon Republic of Korea 34141
Abstract
This study explores Thin Film Encapsulation, highlighting its impressive resistance to crack propagation achieved by intentionally introducing defects between two distinct inorganic materials. Through strategic interface defect engineering, we have successfully reinforced the encapsulation's robustness, contributing to its enhanced performance and durability.