Material innovation and mechanics design for substrates and encapsulation of flexible electronics: a review-Reference-Cited by-同舟云学术

Material innovation and mechanics design for substrates and encapsulation of flexible electronics: a review

Published:2021 Issue:2 Volume:8 Page:383-400
ISSN:2051-6347
Container-title:Materials Horizons
language:en
Short-container-title:Mater. Horiz.

Author:

Li Haibo¹²³⁴⁵,Ma Yinji¹²³⁴⁵,Huang Yonggang⁶⁷⁸⁹¹⁰^ORCID

Affiliation:

1. Department of Engineering Mechanics

2. Center for Flexible Electronics Technology

3. Tsinghua University

4. Beijing 100084

5. China

6. Department of Civil and Environmental Engineering

7. Department of Mechanical Engineering

8. Department of Materials Science and Engineering

9. Center for Bio-Integrated Electronics

10. Northwestern University

Abstract

Advances in materials and mechanics designs have led to the development of flexible electronics, which have important applications to human healthcare due to their good biocompatibility and conformal integration with biological tissue.

Funder

National Natural Science Foundation of China

China Association for Science and Technology

National Postdoctoral Program for Innovative Talents

Publisher

Royal Society of Chemistry (RSC)

Subject

Electrical and Electronic Engineering,Process Chemistry and Technology,Mechanics of Materials,General Materials Science

Link

http://pubs.rsc.org/en/content/articlepdf/2021/MH/D0MH00483A

Reference268 articles.

1. Materials and Mechanics for Stretchable Electronics

2. Flexible Hybrid Electronics for Digital Healthcare

3. Epidermal Electronics

4. Mechanics and thermal management of stretchable inorganic electronics

5. Mechanics of stretchable batteries and supercapacitors

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