Affiliation:
1. Department of Biomedical Engineering City University of Hong Kong 83 Tat Chee Avenue, Kowloon Hong Kong 999077 China
2. Hong Kong Center for Cerebro‐Cardiovascular Health Engineering (COCHE) Hong Kong 999077 China
3. Department of Mechanical and Aerospace Engineering Hong Kong University of Science and Technology Clear Water Bay Hong Kong China
4. City University of Hong Kong Futian – Shenzhen Research Institute Shenzhen 518057 China
Abstract
AbstractThe utilization of hydrogels in soft electronics has led to significant progress in the field of wearable and implantable devices. However, challenges persist in hydrogel electronics, including the delicate equilibrium between stretchability and electrical conductivity, intricacies in miniaturization, and susceptibility to dehydration. Here, a lignin‐polyacrylamide (Ag‐LPA) hydrogel composite endowed with anti‐freeze, self‐adhesive, exceptional water retention properties, and high stretchability (1072%) is presented. Notably, this composite demonstrated impressive electrical conductivity at room temperature (47.924 S cm−1) and extremely cold temperatures (42.507 S cm−1). It is further proposed for microfluidic‐assisted hydrogel patches (MAHPs) to facilitate customizable designs of the Ag‐LPA hydrogel composite. This approach enhances water retention and offers versatility in packaging materials, making it a promising choice for enduring soft electronics applications. As a proof‐of‐concept, soft electronics across diverse applications and dimensions, encompassing healthcare monitoring, environmental temperature sensing, and 3D‐spring pressure monitoring electronics are successfully developed. The scenery of an extremely cold environment is further extended. The conductivity of the embedded Ag‐LPA hydrogel composite unveils the potential of MAHPs in polar rescue missions. It is envisioned that MAHPs will impact the development of sophisticated and tailored soft electronics, thereby forging new frontiers in engineering applications.
Funder
City University of Hong Kong
Innovation and Technology Fund
Environment and Conservation Fund