In‐Liquid Plasma for Surface Engineering of Cu Electrodes with Incorporated SiO 2 Nanoparticles: From Micro to Nano-Reference-Cited by-同舟云学术

In‐Liquid Plasma for Surface Engineering of Cu Electrodes with Incorporated SiO 2 Nanoparticles: From Micro to Nano

Published:2021-10-27 Issue:6 Volume:32 Page:2107058
ISSN:1616-301X
Container-title:Advanced Functional Materials
language:en
Short-container-title:Adv Funct Materials

Author:

Menezes Pramod V.¹,Elnagar Mohamed M.¹^ORCID,Al‐Shakran Mohammad¹,Eckl Maximilian J.¹,Menezes Prashanth W.²³,Kibler Ludwig A.¹,Jacob Timo¹⁴⁵

Affiliation:

1. Institute of Electrochemistry Ulm University 89081 Ulm Germany

2. Institute of Chemistry Technical University of Berlin 10623 Berlin Germany

3. Materials Chemistry Group for Thin Film Catalysis – CatLab Helmholtz‐Zentrum Berlin für Materialien und Energie Albert‐Einstein‐Str. 15 12489 Berlin Germany

4. Helmholtz‐Institute‐Ulm (HIU) Electrochemical Energy Storage 89081 Ulm Germany

5. Karlsruhe Institute of Technology (KIT) P.O. Box 3640 76021 Karlsruhe Germany

Publisher

Wiley

Subject

Electrochemistry,Condensed Matter Physics,Biomaterials,Electronic, Optical and Magnetic Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adfm.202107058

Reference79 articles.

1. What Should We Make with CO2 and How Can We Make It?

2. What would it take for renewably powered electrosynthesis to displace petrochemical processes?

3. Emerging opportunities for electrochemical processing to enable sustainable chemical manufacturing

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5. Design Strategies for Electrocatalysts from an Electrochemist’s Perspective

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