1. In Epoxy Resins, 2nd ed.; Ed.; Marcel Dekker: New York, 1988; pp 860-868.
2. Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices
3. ; Proc. 49th Electronic Components and Technology Conference, San Diego, CA, 1999, pp 34-42.
4. ; ; ; Proc 47th Electronic Components and Technology Conference, San Jose, CA, 1997, pp 859-865.