Low-temperature direct bonding of poly(methyl methacrylate) for polymer microchips-Reference-Cited by-同舟云学术

Low-temperature direct bonding of poly(methyl methacrylate) for polymer microchips

Published:2007 Issue:3 Volume:2 Page:301-306
ISSN:1931-4973
Container-title:IEEJ Transactions on Electrical and Electronic Engineering
language:en
Short-container-title:IEEJ Trans Elec Electron Eng

Author:

Shinohara Hidetoshi,Mizuno Jun,Shoji Shuichi

Publisher

Wiley

Subject

Electrical and Electronic Engineering

Reference11 articles.

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2. , , , , , , , . Fabrications of micro-channel device by hot emboss and direct bonding of PMMA. Proceedings of the 2004 International Conference on MEMS, NANO, and Smart Systems, Banff, Canada; 2004; 26–29.

3. Applications of Atmospheric-Pressure Glow Plasma: Practical Uses of the Atmospheric-Pressure Plasma Processing Unit "Aiplasma"

4. , , , , , , , , . Cyclo-olefin polymer direct bonding using low temperature plasma activation bonding. Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems, Seoul, Korea; 2005; 1346–1349.

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