Thermal performance and entropy generation of single‐layer and double‐layer constructal Y‐shaped bionic microchannel heat sinks-Reference-Cited by-同舟云学术

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Thermal performance and entropy generation of single‐layer and double‐layer constructal Y‐shaped bionic microchannel heat sinks

Published:2021-01-25 Issue:6 Volume:45 Page:9449-9462
ISSN:0363-907X
Container-title:International Journal of Energy Research
language:en
Short-container-title:Int J Energy Res

Author:

Duan Zhijian¹²,Xie Gongnan²^ORCID,Shen Han¹,Wang Chi‐Chuan³

Affiliation:

1. School of Mechanical Engineering Northwestern Polytechnical University Xi'an China

2. School of Marine Science and Technology Northwestern Polytechnical University Xi'an China

3. Department of Mechanical Engineering National Chiao Tung University Hsinchu Taiwan, China

Funder

Ministry of Science and Technology, Taiwan

Higher Education Discipline Innovation Project

Publisher

Wiley

Subject

Energy Engineering and Power Technology,Fuel Technology,Nuclear Energy and Engineering,Renewable Energy, Sustainability and the Environment

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/er.6473

Reference41 articles.

1. Helping chips to keep their cool

2. High-performance heat sinking for VLSI

3. Forced convective heat transfer optimization of plate-fin heat sink with insert-induced turbulence

4. Thermal performance of finned aluminum heat sink filled with ERG aluminum foam: Experimental and numerical approach

5. Research on the mechanism of heat transfer enhancement in microchannel heat sinks with micropin fins

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