Polyurethane-modified epoxy resin: Solventless preparation and properties
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Reference21 articles.
1. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
2. Influence of interphase and moisture on the dielectric spectroscopy of epoxy/silica composites
3. Preparation and characterization of epoxy composites filled with functionalized nanosilica particles obtained via sol–gel process
4. Dielectric properties of three ceramic/epoxy composites
5. Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging
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2. Kinetics of epoxy resin optical characteristics during ultrasonic processing;Journal of Composite Materials;2021-11-11
3. Structure and properties evaluation of epoxy resin modified with polyurethane based on polymeric MDI and different polyols;Polymers and Polymer Composites;2018-12-09
4. The Properties of Regenerative Polymer Mass;Advances in Science and Technology Research Journal;2017-09-03
5. Study on epoxy resin modified by polyether ionic liquid;IOP Conference Series: Materials Science and Engineering;2017-06
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