Graphene integration with nitride semiconductors for high power and high frequency electronics-Reference-Cited by-同舟云学术

Graphene integration with nitride semiconductors for high power and high frequency electronics

Published:2016-10-17 Issue:4 Volume:214 Page:1600460
ISSN:1862-6300
Container-title:physica status solidi (a)
language:en
Short-container-title:Phys. Status Solidi A

Author:

Giannazzo F.¹,Fisichella G.¹,Greco G.¹,La Magna A.¹,Roccaforte F.¹,Pecz B.²,Yakimova R.³,Dagher R.⁴⁵,Michon A.⁴,Cordier Y.⁴

Affiliation:

1. CNR-IMM, Strada VIII, 5; Zona Industriale; 95121 Catania Italy

2. Institute for Technical Physics and Materials Science Research; Centre for Energy Research; HAS Budapest Hungary

3. Department of Physics, Chemistry and Biology; Linköping University; Linköping Sweden

4. CRHEA-CNRS; Rue Bernard Gregory; 06560 Valbonne France

5. Université de Nice Sophia-Antipolis; 28 Av. Valrose 06103 Nice France

Publisher

Wiley

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/pssa.201600460/fullpdf

Reference87 articles.

1. The roles of structural imperfections in InGaN-based blue light-emitting diodes and laser diodes;Nakamura;Science,1998

2. Nitride semiconductors free of electrostatic fields for efficient white light-emitting diodes;Waltereit;Nature,2000

3. Present status and future prospect of wide gap semiconductor high-power devices;Okumura;Jpn. J. Appl. Phys., Part 1,2006

4. Electric field effect in atomically thin carbon films;Novoselov;Science,2004

Cited by 41 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Atomic-scale simulation of ultrasonic vibration-assisted polishing process for graphene/GaN-layered composites;Materials Science in Semiconductor Processing;2024-06

2. Integration of graphene and MoS2 on silicon carbide: Materials science challenges and novel devices;Materials Science in Semiconductor Processing;2024-05

3. Pompom 3D flower like carbon-based Mn3O4 thin film electrodes for high performance supercapacitors;Journal of Alloys and Compounds;2023-12

4. Emerging SiC Applications beyond Power Electronic Devices;Micromachines;2023-06-06

5. Intramolecularly Stabilized o-Carboranyl Aluminum Complexes: Synthesis, Characterization, and X-ray Structural Studies;Crystals;2023-05-27