Improved planar device isolation in AlGaN/GaN HEMTs on Si by ultra-heavy 131 Xe+ implantation

Author:

Li Yang1,Ng Geok Ing12,Arulkumaran Subramaniam2,Liu Zhi Hong3,Ranjan Kumud2,Ang Kian Siong2,Murmu Peter Paul4,Kennedy John45

Affiliation:

1. School of Electrical and Electronic Engineering; Nanyang Technological University; 50 Nanyang Avenue Singapore 639798

2. Temasek Laboratories@NTU; Nanyang Technological University; 9th Storey, BorderX Block, Research Techno Plaza, 50 Nanyang Drive Singapore 637553

3. Singapore-MIT Alliance for Research and Technology; 1 Create Way, #10-01 Create Tower Singapore 138602

4. National Isotope Centre; GNS Science, 30 Gracefield Road, PO Box 31312 Lower Hutt 5010 New Zealand

5. The MacDiarmid Institute for Advanced Materials and Nanotechnology; Victoria University of Wellington; PO Box 600 Wellington 6140 New Zealand

Publisher

Wiley

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Au-free low temperature ohmic contacts for AlGaN/GaN power devices on 200 mm Si substrates;Firrincieli;Jpn. J. Appl. Phys,2014

2. Very-high power density AlGaN/GaN HEMTs;Wu;IEEE Trans. Electron Devices,2001

3. Optimization of AlGaN/GaN HEMTs for high frequency operation;Palacios;Phys. Status Solidi,2006

4. Reverse gate-Current of AlGaN/GaN HFETs: Evidence of leakage at mesa sidewalls;Rahbardar Mojaver;IEEE Trans. Electron Devices,2016

5. Thermally stable device isolation by inert gas heavy ion implantation in AlGaN/GaN HEMTs on Si;Arulkumaran;J. Vac. Sci. Technol. B Microelectron. Nanometer Struct,2016

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