High‐Resolution Patterning of Organic–Inorganic Photoresins for Tungsten and Tungsten Carbide Microstructures

Abstract

Tungsten is an important material for high‐temperature applications due to its high chemical and thermal stability. Its carbide, that is, tungsten carbide, is used in tool manufacturing because of its outstanding hardness and as a catalyst scaffold due to its morphology and large surface area. However, microstructuring, especially high‐resolution 3D microstructuring of both materials, is a complex and challenging process which suffers from slow speeds and requires expensive specialized equipment. Traditional subtractive machining methods, for example, milling, are often not feasible because of the hardness and brittleness of the materials. Commonly, tungsten and tungsten carbide are manufactured by powder metallurgy. However, these methods are very limited in the complexity and resolution of the produced components. Herein, tungsten ion‐containing organic–inorganic photoresins, which are patterned by two‐photon lithography (TPL) at micrometer resolution, are introduced. The printed structures are converted to tungsten or tungsten carbide by thermal debinding and reduction of the precursor or carbothermal reduction reaction, respectively. Using TPL, complex 3D tungsten and tungsten carbide structures are prepared with a resolution down to 2 and 7 μm, respectively. This new pathway of structuring tungsten and its carbide facilitates a broad range of applications from micromachining to metamaterials and catalysis.