Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen‐Free Copper Wires-Reference-Cited by-同舟云学术

Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen‐Free Copper Wires

Published:2022-03-27 Issue:9 Volume:24 Page:2200037
ISSN:1438-1656
Container-title:Advanced Engineering Materials
language:en
Short-container-title:Adv Eng Mater

Author:

Sun Pengfei¹²^ORCID,Li Zhiwei³,Hou Jiapeng¹,Xu Aimin³,Wang Qiang¹,Zhang Yi³,Zhang Zhenjun¹,Zhang Penglin²,Zhang Zhefeng¹

Affiliation:

1. Shi-Changxu Innovation Center for Advanced Materials Institute of Metal Research Chinese Academy of Sciences 72 Wenhua Road Shenyang 110016 P. R. China

2. State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals Lanzhou University of Technology Lanzhou 730050 P. R. China

3. National Quality Supervision and Inspection Center of Electrical Equipment Safety Performance Zhejiang Huadian Equipment Testing Institute Hangzhou 310015 P. R. China

Funder

National Natural Science Foundation of China

State Grid Corporation of China

China Postdoctoral Science Foundation

Publisher

Wiley

Subject

Condensed Matter Physics,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adem.202200037

Reference34 articles.

1. Twenty-year uninterrupted endeavor of friction stir processing by focusing on copper and its alloys