Strengthening Mechanisms and Thermal Models of Chemically Incompatible Metals (Mo/W–Cu): A Review

Abstract

Molybdenum/tungsten–copper matrix composites are widely used in electronic engineering, aerospace, and other fields because of their excellent properties such as high hardness, high mechanical strength, low electrical and thermal conductivity, adjustable thermal expansion coefficient, and good high‐temperature stability. The densification, mechanical properties, and thermal properties are attributed to additive alloying elements, grain size and structure, and sintering parameters. Nevertheless, there are still some problems with densifying the composites due to the chemical incompatibility of molybdenum/tungsten and copper, and therefore the densification and strengthening mechanisms are reviewed to further improve densification and properties. Currently, the factors affecting thermal performance are scattered. Herein, the factors affecting the thermal conductivity of molybdenum/tungsten–copper matrix composites are reviewed, which provides a reference for the comprehensive performance optimization of molybdenum/tungsten–copper matrix composites. The future structure and simulation of molybdenum/tungsten–copper composites are also prospected. It provides a new way to improve the properties and structure of chemically incompatible metal composites.