High‐Performance, Multifunctional, and Designable Carbon Fiber Felt Skeleton Epoxy Resin Composites EP/CF‐(CNT/AgBNs)x for Thermal Conductivity and Electromagnetic Interference Shielding

Author:

Luo Jiamei123,Yang Xueqin13,Xue Yi12,Yang Chenxi1,Yang Zehao12,Cai Zhixiang12,Liu Yong1,Ma Yu1,Zhang Hui12ORCID,Yu Jianyong23

Affiliation:

1. State Key Laboratory for Modification of Chemical Fibers and Polymer Materials College of Materials Science and Engineering Donghua University Shanghai 201620 China

2. Center for Civil Aviation Composites Donghua University Shanghai 201620 China

3. Innovation Center for Textile Science and Technology Donghua University Shanghai 201620 China

Abstract

AbstractIn this work, high‐performance epoxy resin (EP) composites with simultaneous excellent thermal conductivity (TC) and outstanding electromagnetic shielding properties are fabricated through the structural synergy of 1D carbon nanotubes and 2D silver‐modified boron nitride nanoplates (CNT/AgBNs) to erect microscopic 3D networks on long‐range carbon fiber (CF) felt skeletons. The line‐plane combination of CNT/AgBNs improve the interfacical bonding involving EP and CF felts and alleviate the phonon scattering at the interface. Eventually, the TC of the EP composites is enhanced by 333% (up to 0.91 W m−1 K−1) with respect to EP due to the efficient and orderly transmission of phonons along the 3D pathway. Meanwhile, the unique anisotropic structure of CF felt and exceptional insulating BNs diminishes the electronic conduction between CNT and CFs, which protects the through‐plane insulating properties of EP composites. Furthermore, the EP composites present favorable electromagnetic shielding properties (51.36 dB) attributed to the multiple reflection and adsorption promoted by the multiple interfaces of stacked AgBNs and heterointerface among CNT/AgBNs, CF felt and EP. Given these distinguishing features, the high‐performance EP composites open a convenient avenue for electromagnetic wave (EMW) shielding and thermal management applications.

Funder

Science and Technology Commission of Shanghai Municipality

Fundamental Research Funds for the Central Universities

Publisher

Wiley

Subject

Biomaterials,Biotechnology,General Materials Science,General Chemistry

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