Research on High‐Efficiency Curved Surface Polishing with Even Distribution of Slurry Based on Dielectrophoresis

Author:

Deng Qianfa12,Zhang Chengqi12ORCID,Sun Lizhi3,Lyu Binghai12,Wang Xu12,Cheng Jun12

Affiliation:

1. Ultra‐Precision Machining Center Zhejiang University of Technology Hangzhou 310023 Zhejiang China

2. Key Laboratory of Special Purpose Equipment and Advanced Manufacturing Technology Zhejiang University of Technology Ministry of Education Hangzhou 310023 Zhejiang China

3. Department of Civil & Environmental Engineering University of California Irvine Irvine 92697‐2175 CA USA

Abstract

To overcome the problems of low slurry utilization and poor surface uniformity in conventional small tool polishing of curved surfaces, a small tool polishing method based on slurry dielectrophoresis (STP‐DEP) is proposed. The dielectrophoretic effect distributes the slurry evenly and increases its dwell time in the processing area, enabling more abrasives to participate in polishing, thereby improving the material removal efficiency and surface uniformity of the workpiece. The observation experiment indicates that dielectrophoresis can efficiently distribute the slurry evenly. Compared with the traditional small tool polishing, the results show that the polishing efficiency of the STP‐DEP is improved by 34% on the premise of achieving the same surface roughness Ra of the workpiece. The Taguchi experiments are carried out on K9 convex lens. Results show that the optimal surface roughness Ra 3.3 nm (initial Ra 2400 nm, processing time 120 min) is obtained when the tool speed is 400 rpm, the pressing amount is 1 mm, the infeed angle is 15°, and the abrasive size is 3 μm. The research proves that the STP‐DEP successfully solves the problem of slurry uneven distribution, and realizes efficient surface polishing with high surface uniformity.

Funder

National Natural Science Foundation of China

Natural Science Foundation of Zhejiang Province

Publisher

Wiley

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