Phosphorus-containing epoxy resin for an electronic application
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Reference29 articles.
1. Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices
2. Toughening of epoxy resins by modification with reactive elastomers composed of butyl acrylate and glycidyl (meth)acrylate
3. Effects of particle size on mechanical and impact properties of epoxy resin filled with spherical silica
4. Modification of epoxy resins by hydrosilation for electronic encapsulation application
5. Curing of N,N′-diglycidylimides with polyfunctional compounds
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