Preparation of binder‐free spherical submicron‐sized platinum particles using laser melting in liquids
Author:
Affiliation:
1. Shimane University
2. Hokkaido University
3. AIST
Publisher
Wiley
Subject
Applied Mathematics,Electrical and Electronic Engineering,Computer Networks and Communications,General Physics and Astronomy,Signal Processing
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/ecj.12330
Reference19 articles.
1. Novel approaches for low temperature sintering of inkjet-printed inorganic nanoparticles for roll-to-roll (R2R) applications
2. Low temperature sintering of Ag nanoparticles for flexible electronics packaging
3. Tanaka Kikinzoku KogyoKK:Low‐Temperature Baked Paste for Au‐Au Bonding AuRoFUSE™ https://pro.tanaka.co.jp/en/products/AuRoFUSE.html
4. Preparation of Dispersed Spherical Platinum Particles with Controlled Size and Internal Structure
5. Submicron-Sized Boron Carbide Particles Encapsulated in Turbostratic Graphite Prepared by Laser Fragmentation in Liquid Medium
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