Influence of Chloride and Nitrate Anions on Copper Electrodeposition onto Au(111) from Deep Eutectic Solvents-Reference-Cited by-同舟云学术

Influence of Chloride and Nitrate Anions on Copper Electrodeposition onto Au(111) from Deep Eutectic Solvents

Published:2022-08-04 Issue:19 Volume:9 Page:
ISSN:2196-0216
Container-title:ChemElectroChem
language:en
Short-container-title:ChemElectroChem

Author:

Geng Tanja¹^ORCID,Schick Benjamin W.¹^ORCID,Uhl Matthias¹^ORCID,Kuehne Alexander J. C.²^ORCID,Kibler Ludwig A.¹^ORCID,Ceblin Maximilian U.¹^ORCID,Jacob Timo¹³⁴^ORCID

Affiliation:

1. Institute of Electrochemistry Ulm University Albert-Einstein-Allee 47 89081 Ulm Germany

2. Institute of Organic and Macromolecular Chemistry Ulm University Albert-Einstein-Allee 11 89081 Ulm Germany

3. Helmholtz-Institute Ulm (HIU) for Electrochemical Energy Storage Helmholtzstr. 11 89081 Ulm Germany

4. Karlsruhe Institute of Technology (KIT) P.O. Box 3640 76021 Karlsruhe Germany

Publisher

Wiley

Subject

Electrochemistry,Catalysis

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/celc.202101263

Reference59 articles.

1. Advanced copper electroplating for application of electronics

2. Via-filling using electroplating for build-up PCBs

3. Filling mechanism in microvia metallization by copper electroplating

4. Copper Electrodeposition for Nanofabrication of Electronics Devices

5. Copper electrodeposition from a chloride free deep eutectic solvent

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