Unconventional Electrochemical Behaviors of Cu Underpotential Deposition in a Chloride-Based Deep Eutectic Solvent: High Underpotential Shift and Low Coverage-Reference-Cited by-同舟云学术

Unconventional Electrochemical Behaviors of Cu Underpotential Deposition in a Chloride-Based Deep Eutectic Solvent: High Underpotential Shift and Low Coverage

Published:2023-04-07 Issue:15 Volume:95 Page:6458-6466
ISSN:0003-2700
Container-title:Analytical Chemistry
language:en
Short-container-title:Anal. Chem.

Author:

Tan Zhuo¹^ORCID,Li Kaixuan¹,Gu Yu¹^ORCID,Nan Ziang¹,Wang Weiwei¹,Sun Lan¹,Mao Bingwei¹^ORCID,Yan Jiawei¹^ORCID

Affiliation:

1. State Key Laboratory of Physical Chemistry of Solid Surfaces and Department of Chemistry, College of Chemistry and Chemical Engineering, Engineering Research Center of Electrochemical Technologies of Ministry of Education, Xiamen University, Xiamen 361005, China

Funder

National Natural Science Foundation of China

Publisher

American Chemical Society (ACS)

Subject

Analytical Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.analchem.3c00637

Reference92 articles.

1. Damascene copper electroplating for chip interconnections

2. Copper/carbon nanotube composites: research trends and outlook

3. 1D Copper Nanostructures: Progress, Challenges and Opportunities

4. A Review of Nanoporous Metals in Interconnects

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