The Influence of Casting-Calendering Process on the Microstructure of Pure Al2 O3 Ceramic Substrate
Author:
Affiliation:
1. Shantou University Shantou; College of Engineering; Guangdong 515063 China
Publisher
John Wiley & Sons, Inc.
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/9781119543381.ch2/fullpdf
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2. Microstructure and Toughening of SiC-AlN Ceramics Induced by Seeding with Alpha-SiC;Lim;Journal of Ceramic Processing Research,2010
3. Fabrication and Characterization of Aluminum Nitride Thick Film Coated on Aluminum Substrate for Heat Dissipation;Hahn;Ceramics International,2016
4. A Study on the Heat Dissipation of High Power Multi-chip COB LEDs;Wu;Microelectronics Journal,2012
5. Heat Transfer Characteristics in High Power LED Packaging;Chung;Smart Science,2014
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