Influence of very long aging on the relaxation behavior of flame-retardant printed circuit board epoxy composites under mechatronic conditions-Reference-Cited by-同舟云学术

Influence of very long aging on the relaxation behavior of flame-retardant printed circuit board epoxy composites under mechatronic conditions

Published:2013-04-04 Issue:2 Volume:130 Page:786-792
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Lé-Magda Mélanie¹²³,Dargent Eric¹,Puente Jorge Arturo Soto¹,Guillet Alain²,Font Emmanuelle³,Saiter Jean-Marc¹

Affiliation:

1. Advanced Materials and Mechanical Engineering-Laboratoire d'Etude et de Caractérisation des Amorphes et de Polymères (AMME-LECAP EA4528) International Laboratory; Université et Institut National des Sciences Appliquées (INSA) de Rouen; avenue de l'Université 76801 Saint Etienne du Rouvray Cedex France

2. Groupe de Physique des Matériaux Unité mixte de recherche (UMR) CNRS Université et Institut National des Sciences Appliquées (INSA) de Rouen; avenue de l'Université 76801 Saint Etienne du Rouvray Cedex France

3. Laboratoire National d'Essai (LNE); 29 avenue Roger Hennequin 78297 Trappes France

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Reference37 articles.

1. Effects of zinc-based flame retardants on the degradation behaviour of an aerospace epoxy matrix

2. Development of an environmentally friendly solventless process for electronic prepregs

3. Spall strength of glass fiber reinforced polymer composites

4. Accelerated aging versus realistic aging in aerospace composite materials. I. The chemistry of thermal aging in a low-temperature-cure epoxy composite

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