Multiscale Modeling of Low Pressure Plasma Etching Processes: Linking the Operating Parameters of the Plasma Reactor with Surface Roughness Evolution-Reference-Cited by-同舟云学术

Multiscale Modeling of Low Pressure Plasma Etching Processes: Linking the Operating Parameters of the Plasma Reactor with Surface Roughness Evolution

Published:2016-10-28 Issue:4-5 Volume:14 Page:1600147
ISSN:1612-8850
Container-title:Plasma Processes and Polymers
language:en
Short-container-title:Plasma Process Polym

Author:

Mouchtouris Sotiris¹,Kokkoris George¹

Affiliation:

1. Institute of Nanoscience and Nanotechnology; NCSR “Demokritos”; Agia Paraskevi 15341 Attica Greece

Funder

Ministry of Education, Lifelong Learning, and Religious Affairs for funding through the project ‘CORSED: Control of Surface Roughness by Simultaneous to Etching Deposition’

European Social Fund (ESF)-European Union and National Resources

Publisher

Wiley

Subject

Polymers and Plastics,Condensed Matter Physics

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/ppap.201600147/fullpdf

Reference93 articles.

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2. A Review of Multiscale Analysis: Examples from Systems Biology, Materials Engineering, and Other Fluid–Surface Interacting Systems

3. SEM++: A particle model of cellular growth, signaling and migration

4. Multiscale simulation of nanosystems

5. Novel approaches to multiscale modelling in materials science

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