Etch Mechanism and Temperature Regimes of an Atmospheric Pressure Chlorine-Based Plasma Jet Process
Author:
Affiliation:
1. Martin-Luther-Universität Halle Wittenberg; Heinrich-Damerow-Str. 4 06120 Halle Germany
2. Leibniz Institute of Surface Modification; Permoserstr. 15 04318 Leipzig Germany
Funder
German Federal Ministry of Education and Research
Publisher
Wiley
Subject
Polymers and Plastics,Condensed Matter Physics
Reference18 articles.
1. Extreme ultraviolet lithography: A review
2. Reactive Plasma Jet High-Rate Etching of SiC
3. Fabrication of X-ray mirrors for synchrotron applications
4. Ultra-Precision Surface Machining with Reactive Plasma Jets
5. Rapid optical surface figuring using reactive atom plasma
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