Wafer Scale Solventless Adhesive Bonding with iCVD Polyglycidylmethacrylate: Effects of Bonding Parameters on Adhesion Energies-Reference-Cited by-同舟云学术

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Wafer Scale Solventless Adhesive Bonding with iCVD Polyglycidylmethacrylate: Effects of Bonding Parameters on Adhesion Energies

Published:2015-04-28 Issue:9 Volume:2 Page:1500076
ISSN:2196-7350
Container-title:Advanced Materials Interfaces
language:en
Short-container-title:Adv. Mater. Interfaces

Author:

Jeevendrakumar Vijay Jain Bharamaiah¹,Pascual Daniel N.¹,Bergkvist Magnus¹

Affiliation:

1. College of Nanoscale Science and Engineering; SUNY Polytechnic Institute; 257 Fuller Road Albany NY 12203 USA

Funder

Semiconductor Research Corporation

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/admi.201500076/fullpdf

Reference46 articles.

1. A new encapsulation solution for flexible organic solar cells

2. Layer-by-layer assembly of thin film oxygen barrier

3. Electrostatic Assembly of Conjugated Polymer Thin Layers on Electrospun Nanofibrous Membranes for Biosensors

4. Sulfonated and crosslinked polyphosphazene-based proton-exchange membranes

5. Low-temperature full wafer adhesive bonding

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4. Initiated Chemical Vapor Deposition of polysiloxane as adhesive nanolayer for silicon wafer bonding;Materials Science in Semiconductor Processing;2022-09

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