Thermal Conductivity Enhancement of Soft Polymer Composites through Magnetically Induced Percolation and Particle–Particle Contact Engineering-Reference-Cited by-同舟云学术

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Thermal Conductivity Enhancement of Soft Polymer Composites through Magnetically Induced Percolation and Particle–Particle Contact Engineering

Published:2019-01-30 Issue:6 Volume:6 Page:1801857
ISSN:2196-7350
Container-title:Advanced Materials Interfaces
language:en
Short-container-title:Adv. Mater. Interfaces

Author:

Ralphs Matthew¹,Kong Wilson¹,Wang Robert Y.¹,Rykaczewski Konrad¹^ORCID

Affiliation:

1. School for Engineering of MatterTransport and EnergyArizona State University Tempe AZ 85287 USA

Funder

Semiconductor Research Corporation

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/admi.201801857

Reference54 articles.

1. Microscopic and macroscopic thermal contact resistances of pressed mechanical contacts

2. R. S. Prasher C.‐P. Chiu Materials for Advance Packaging 2017 Springer Switzerland 511 535

3. Thermal Issues in Next-Generation Integrated Circuits

4. Emerging challenges and materials for thermal management of electronics

5. Thermal conductivity of carbon nanotubes and their polymer nanocomposites: A review

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