Enhanced Interface Stability of Multilayer Bi 2 Te 3 /Ti/Cu Films after Heat Treatment via the Insertion of a Ti Layer-Reference-Cited by-同舟云学术

Enhanced Interface Stability of Multilayer Bi 2 Te 3 /Ti/Cu Films after Heat Treatment via the Insertion of a Ti Layer

Author:

Qin Dongli¹,Zhu Wei¹^ORCID,Hai Fengxun²,Wang Chunjun¹,Cui Jiaolin³,Deng Yuan⁴⁵

Affiliation:

1. School of Materials Science and EngineeringBeihang University Beijing 100083 China

2. School of Energy and Power EngineeringBeihang University Beijing 100083 China

3. School of Materials and Chemical EngineeringNingbo University of Technology No. 201, Fenghua Road Ningbo 315211 China

4. School of Materials Science and EngineeringBeihang University No. 37 Xueyuan Road Beijing 100191 China

5. Beijing Advanced Innovation Center for Biomedical EngineeringBeihang University Beijing 100083 China

Funder

National Natural Science Foundation of China

Natural Science Foundation of Beijing Municipality

Fundamental Research Funds for the Central Universities

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

Link

Reference35 articles.

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