Improvement of bond strength of BPDA-PDA-type polyimide film by corona discharge treatment-Reference-Cited by-同舟云学术

Improvement of bond strength of BPDA-PDA-type polyimide film by corona discharge treatment

Published:2006 Issue:4 Volume:100 Page:3403-3408
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Ogawa Toshio,Baba Shigenori,Fujii Yuichiro

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Reference18 articles.

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5. Plasma surface modification of polyimide for improving adhesion to electroless copper coatings

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