Multifunctional Shape‐Stabilized Phase Change Materials with Enhanced Thermal Conductivity and Electromagnetic Interference Shielding Effectiveness for Electronic Devices-Reference-Cited by-同舟云学术

Multifunctional Shape‐Stabilized Phase Change Materials with Enhanced Thermal Conductivity and Electromagnetic Interference Shielding Effectiveness for Electronic Devices

Published:2021-04-19 Issue:6 Volume:306 Page:2100055
ISSN:1438-7492
Container-title:Macromolecular Materials and Engineering
language:en
Short-container-title:Macromol. Mater. Eng.

Author:

Liang Yanjuan¹²^ORCID,Tong Yelong³,Tao Zechao¹²,Guo Quangui⁴²⁵,Hao Baoyi¹²,Liu Zhanjun¹²

Affiliation:

1. Key Laboratory of Carbon Materials Institute of Coal Chemistry Chinese Academy of Sciences Taiyuan 030001 China

2. Center of Materials Science and Optoelectronics Engineering University of Chinese Academy of Sciences Beijing 100049 China

3. Chinese Academy of Space Technology Beijing 100049 China

4. Key Laboratory of Carbon Materials Institutes of Coal Chemistry Chinese Academy of Sciences Taiyuan 030001 China

5. Corporation of Foshan ZhongkeSiwei Thermal Management Technologies Foshan 528300 China

Funder

Youth Innovation Promotion Association of the Chinese Academy of Sciences

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Organic Chemistry,General Chemical Engineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/mame.202100055

Reference41 articles.

1. Combination of heat storage and thermal spreading for high power portable electronics cooling

2. Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: Effect of pin thickness and PCM volume fraction

3. Finned heat pipe assisted low melting point metal PCM heat sink against extremely high power thermal shock

4. Liquid crystalline texture and hydrogen bond on the thermal conductivities of intrinsic thermal conductive polymer films

5. Interfacial thermal resistance in thermally conductive polymer composites: A review

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