Fabrication of High Thermally Conductive and Electrical Insulating Composites by Boron Nitride‐Nanosheet‐Coated PEEK Fiber-Reference-Cited by-同舟云学术

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Fabrication of High Thermally Conductive and Electrical Insulating Composites by Boron Nitride‐Nanosheet‐Coated PEEK Fiber

Published:2021-10-13 Issue:12 Volume:306 Page:2100532
ISSN:1438-7492
Container-title:Macromolecular Materials and Engineering
language:en
Short-container-title:Macro Materials & Eng

Author:

Sun Youli¹,Dang Hongbo¹,Tan HaoYuan¹,Luan Jiashuang¹,Jiang Dong¹,Yang Yanhua¹^ORCID

Affiliation:

1. College of Chemistry Engineering Research Center of High‐Performance Plastics Ministry of Education Jilin University Changchun 130012 P. R. China

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Organic Chemistry,General Chemical Engineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/mame.202100532

Reference54 articles.

1. Thermoelectric plastics: from design to synthesis, processing and structure–property relationships

2. Thermal conductivity of polymer-based composites: Fundamentals and applications

3. Two-Dimensional Materials for Thermal Management Applications

4. Review of thermal conductivity in composites: Mechanisms, parameters and theory

5. Enhancing the Heat Transfer Efficiency in Graphene–Epoxy Nanocomposites Using a Magnesium Oxide–Graphene Hybrid Structure

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1. Effect of stacking pattern of multilayered polyetheretherketone/boron nitride composites on the mechanical and thermal properties: Experiments and molecular dynamics simulations;Composites Part A: Applied Science and Manufacturing;2024-12

2. Synthesis of Spherical Hexagonal Boron Nitride via Precursor Morphology Control;Advanced Engineering Materials;2024-07-02

3. Enhanced dielectric performance and thermal conductivity of the polyetherketoneketone composite films prepared via a facile template spray coating method;Materials Today Communications;2024-06

4. Dielectric thermally conductive boron nitride/silica@MWCNTs/polyvinylidene fluoride composites via a combined electrospinning and hot press method;Journal of Materials Science: Materials in Electronics;2024-05

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