Multiobjective optimization for the optimal heat pipe working parameters based on Taguchi's design of experiments
Author:
Affiliation:
1. Department of Mechanical Engineering Koneru Lakshmaiah Education Foundation, Deemed to be University Guntur Andhra Pradesh India
Publisher
Wiley
Subject
Fluid Flow and Transfer Processes,Condensed Matter Physics
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/htj.22410
Reference63 articles.
1. Heat pipe integrated in direct bonded copper (DBC) technology for cooling of power electronics packaging;Ivanova M;IEEE Trans Power Electron,2006
2. Transient thermal and hydrodynamic model of flat heat pipe for the cooling of electronics components;Sonan R;Int J Heat Mass Transfer,2008
3. An evacuated tubular solar collector incorporating a heat pipe;Bloem H;Philips Tech Rev,1982
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