Heat Pipe Integrated in Direct Bonded Copper (DBC) Technology for Cooling of Power Electronics Packaging-Reference-Cited by-同舟云学术

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Heat Pipe Integrated in Direct Bonded Copper (DBC) Technology for Cooling of Power Electronics Packaging

Published:2006-11 Issue:6 Volume:21 Page:1541-1547
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Ivanova Mariya,Avenas Yvan,Schaeffer Christian,Dezord Jean-Bernard,Schulz-Harder Juergen

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/63/4012130/04012144.pdf?arnumber=4012144

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