Semiconductor wafer bonding
Author:
Publisher
Wiley
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
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1. Bumpless Interconnect of 6-$\mu$m-Pitch Cu Electrodes at Room Temperature;IEEE Transactions on Advanced Packaging;2008-08
2. Silicon wafer bonding via designed monolayers**;Advanced Materials;1995-07
3. Wafer bonding technology for silicon-on-lnsulator applications: A review;Journal of Electronic Materials;1992-07
4. Implanted Carbon: An Effective Etch‐Stop in Silicon;Journal of The Electrochemical Society;1991-05-01
5. Particle Protection of Semiconductor Surfaces by Reversible Wafer Bonding and Related Concepts;Particles on Surfaces 3;1991
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