Role of Alloying Addition in Zn-Based Pb-Free Solders-Reference-Cited by-同舟云学术

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Role of Alloying Addition in Zn-Based Pb-Free Solders

Published:2019-03-29 Issue: Volume: Page:67-90
ISSN:
Container-title:Harsh Environment Electronics
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Author:

Islam Khairul¹,Sharif Ahmed²

Affiliation:

1. Bangladesh Council of Scientific and Industrial Research, IMMM; Science Laboratory Road Joypurhat 5900 Bangladesh

2. Bangladesh University of Engineering and Technology (BUET); Department of Materials and Metallurgical Engineering; Dhaka 1000 Bangladesh

Publisher

Wiley-VCH Verlag GmbH & Co. KGaA

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/9783527813964.ch3/fullpdf

Reference74 articles.

1. Tin-lead (SnPb) solder reaction in flip chip technology;Tu;Materials Science and Engineering R: Reports,2001

2. Isothermal solid-state aging of Pb-5Sn solder bump on Ni/Cu/Ti under bump metallization;Chen;Journal of Alloys and Compounds,2007

3. Interfacial microstructure and shear strength of Ag nanoparticle doped Sn-9Zn solder in ball grid array packages;Gain;Microelectronics Reliability,2009

4. Sn addition on the tensile properties of high temperature Zn-4Al-3Mg solder alloys;Cheng;Microelectronics Reliability,2012

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