Study of Zn-Mg-Ag High-Temperature Solder Alloys-Reference-Cited by-同舟云学术

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Study of Zn-Mg-Ag High-Temperature Solder Alloys

Published:2019-03-29 Issue: Volume: Page:135-146
ISSN:
Container-title:Harsh Environment Electronics
language:
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Author:

Galib Roisul H.¹,Ashif Anwar Md.²,Sharif Ahmed³

Affiliation:

1. University of California San Diego; Department of Mechanical and Aerospace Engineering; La Jolla CA 92093 USA

2. Missouri State University; Department of Physics, Astronomy and Materials Science; 901 South National Avenue Springfield MO 65897 USA

3. Bangladesh University of Engineering and Technology (BUET); Department of Materials and Metallurgical Engineering; Old Academic Building, Zahir Raihan Road Dhaka 1000 Bangladesh

Publisher

Wiley-VCH Verlag GmbH & Co. KGaA

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/9783527813964.ch6/fullpdf

Reference31 articles.

1. Physics and materials challenges for lead-free solders;Tu;Journal of Applied Physics,2003

2. High lead solder (over 85%) solder in the electronics industry: RoHS exemptions and alternatives;Menon;Journal of Materials Science: Materials in Electronics,2015

3. Retarding intermetallic compounds growth of Zn high-temperature solder and Cu substrate by trace element addition;Park;Journal of Materials Science: Materials in Electronics,2013

4. Development of high-temperature solders: review;Zeng;Microelectronics and Reliability,2012

5. Interfacial reaction of eutectic AuSi solder with Si (100) and Si (111) surfaces;Jang;Journal of Applied Physics,2004

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